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Fully Automatic BGA/CSP Solder Ball Mounting System

The Aurigin au800 Solder Ball Placement System is a fully automatic machine developed for today's challenge @ tomorrow's technology.
Key Features:

PRODUCT DETAILS

  • ● Sphere Sizes / Pitch : as small as 0.15mm diameter.
  • ● Sphere Handling : Proprietary design eliminates damages to solder spheres.
  • ● Product Setup : Rapid product change-over with quick-change product tooling.
  • ● Supported : SECS/GEM200, GEM300 Standard and WebAPI.
  • ● Certified : SEMI S2/S8.