SIPLACE XS Placement

1.SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision
2.SIPLACE MultiStar – the only head that automatically changes modes on demand (C&P, P&P, Mixed Mode)
3.SIPLACE TwinStar – the head for special tasks
4.Digital SIPLACE vision system for maximum process stability
5.Available with two, three and four gantries and smart conveyor options for optimized line configurations
6.Modular gantries to meet any production challenges




















The benchmark in high-volume production



Absolute precision and maximum performance have made the SIPLACE X S the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed – the SIPLACE X S delivers.










Video Brochure

















Highlights of the SIPLACE X S:




  • SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision


  • SIPLACE MultiStar – the only head that automatically changes modes on demand (C&P, P&P, Mixed Mode)



  • Digital SIPLACE vision system for maximum process stability


  • Available with two, three and four gantries and smart conveyor options for optimized line configurations


  • Modular gantries to meet any production challenges


  • SIPLACE Smart Pin Support for automatic placement of PCB support pins















Extremely fast and with long-term precision


Faster, more precise, and a true long-distance runner: The new SIPLACE SpeedStar. The perfect collect-and-place head for the fast placement of standard components at the top of your SMT line.
















● 20 segments for maximum speed – up to 48,000 cph on the SIPLACE TX


● For components ranging from 0201 (metric) to 8.2 x 8.2 mm













The first head that changes its mode on demand



Extremely flexible: The SIPLACE MultiStar switches between three different placement modes in response to software commands. It transforms into the right mode for any application. As a result, your line stays perfectly balanced even during frequent product changeovers with no expensive configuration or head changes.















A new level of freedom:

  • Instant switching between collect-and-place, pick-and-place and mixed modes
  • Up to 25,500 cph
  • Widest component spectrum: 01005 to 50 x 40 mm
  • NEW: Component height up to 15,5mm
  • NEW: Maximum placement force up to 15N













Intelligent and forceful


The SIPLACE TwinStar is a high-precision pick-and-place head for the end-of line placement of large and heavy components as well as odd shapes.
















It can pick up components with a nozzle or a gripper. With over 120 grippers for special components, SIPLACE offers everything you need to automatically place connectors and other odd shapes.

  • Precisely adjustable force up to 100 N
  • Component spectrum: 0201 to 200 x 125 mm at a height of 50mm
  • Standard equipment: Fine-pitch camera, vacuum sensor, force sensor, nozzle changes, PCB warpage detection
  • Options: Flip-chip camera, coplanarity module
  • Snap-in detection and real-time 3D measurement
  • NEW: Component weight up to 300 g




























































Manufacture and finance with flexibility










Hit the ground running with smart financing for the SIPLACE SX

As the economy recovers, global demand is on the rise again. You want to keep up with the competition, invest in new capacities and upgrade your equipment, but classic bank loans are too rigid, and the negotiations take too long?

ASMPT has the solution for you

Together with our financing partner Siemens Finance Services (SFS), we offer modern and highly flexible financing solutions that are custom-tailored for your particular needs and capabilities.


Together with our partner Siemens Finance Services, we have already helped many customers with custom-tailored financing. Now we are expanding this program with particularly attractive conditions for SIPLACE SX machines and lines. Since SFS is a specialist for investments in production equipment and we know the value of our machines better than anyone, we are able to offer terms and conditions that are particularly attractive and flexible for our customers.

Stefan Techau, Head of ASMPT Europe







How smart financing works today



You pay for your investment from the added performance and efficiency of your new SIPLACE SX line. You can even include expansions, additional ASMPT options and third-party solutions in the package deal – also retroactively.







starting at € 9,000 per month

1 x DEK Printer starting at € 1,140 per month  
1 x Process Expert starting at € 1,570 per month  
One year later, new customer orders require you to add capacity. The flexible interchangeable gantries of the SIPLACE SX make this easy:
2 x SIPLACE Interchangeable Gantries starting at € 1,700 per month
If you want to keep the original monthly rates constant, you can extend the term for the whole package.


















Intelligent financing


With the innovative and flexible payment plans of our financing partner SFS you expand your entrepreneurial scope by spreading your investment costs over the equipment’s usable life intelligently and in line with your budget.

Would you like to find out more?


Get in touch with us. We will show you how you can get your custom-tailored financing proposal for SIPLACE SX lines and more.





The terms and conditions outlined herein are only indicative and subject to a credit check and acceptance by our partner Siemens Financial Services GmbH.


The terms and conditions outlined herein might not be all-inclusive and are based upon information provided to date. The financing terms and conditions are only indicative and subject to formal credit approval by Siemens Financial Services. This proposal does not represent an offer or commitment by Lessor to enter into a lease transaction or to purchase the Equipment described in this proposal, and does not create any obligation for Lessor. A commitment to enter into the transaction described herein may only be extended by Lessor after this transaction has been approved by all necessary credit and other authorities within Lessor and a “written commitment letter” has been issued by Lessor. All information and quotations here are completely subject to legal requirements of the respective country.